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IC Sockets

Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
0050395288

0050395288

CONN IC DIP SOCKET 28POS TINLEAD

Molex

3,667
RFQ
0050395288

Datasheet

- - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - - Through Hole Closed Frame - - - - - - -
940-99-032-24-000000

940-99-032-24-000000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

1,676
RFQ
940-99-032-24-000000

Datasheet

940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SIP1X11-011B

SIP1X11-011B

SIP1X11-011B-SIP SOCKET 11 CTS

Amphenol ICC (FCI)

4,379
RFQ
SIP1X11-011B

Datasheet

SIP1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
AR 22-HGL-TT

AR 22-HGL-TT

SOCKET

Assmann WSW Components

3,866
RFQ
AR 22-HGL-TT

Datasheet

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR22-HZL-TT

AR22-HZL-TT

CONN IC DIP SOCKET 22POS TIN

Assmann WSW Components

1,194
RFQ
AR22-HZL-TT

Datasheet

- Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
115-83-306-41-003101

115-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,374
RFQ
115-83-306-41-003101

Datasheet

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-304-41-001101

116-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2,289
RFQ
116-87-304-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS44-Z-SM

A-CCS44-Z-SM

CONN SOCKET PLCC 44POS TIN

Assmann WSW Components

2,321
RFQ
A-CCS44-Z-SM

Datasheet

- Bag Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
HLS-0201-T-2

HLS-0201-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,741
RFQ
HLS-0201-T-2

Datasheet

HLS Tube Active SIP 2 (2 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
940-99-044-24-000000

940-99-044-24-000000

CONN SOCKET PLCC 44POS TIN-LEAD

Mill-Max Manufacturing Corp.

2,743
RFQ
940-99-044-24-000000

Datasheet

940 Tube Obsolete PLCC 44 (4 x 11) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-99-020-17-400000

940-99-020-17-400000

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

1,491
RFQ
940-99-020-17-400000

Datasheet

940 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AJ 24-LC

AJ 24-LC

SOCKET

Assmann WSW Components

2,229
RFQ
AJ 24-LC

Datasheet

- Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
123-83-304-41-001101

123-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

1,670
RFQ
123-83-304-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP318-011B

DIP318-011B

DIP318-011B-DIP SOCKET 18 CTS

Amphenol ICC (FCI)

4,665
RFQ
DIP318-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
04-1518-10T

04-1518-10T

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

1,316
RFQ
04-1518-10T

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP1X09-001B

SIP1X09-001B

SIP1X09-001B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

3,583
RFQ
SIP1X09-001B

Datasheet

SIP1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X07-157B

SIP050-1X07-157B

1X07-157B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

4,971
RFQ
SIP050-1X07-157B

Datasheet

SIP050-1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X13-011B

SIP1X13-011B

SIP1X13-011B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

1,103
RFQ
SIP1X13-011B

Datasheet

SIP1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X06-160B

SIP050-1X06-160B

1X06-160B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

1,603
RFQ
SIP050-1X06-160B

Datasheet

SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR20-HZL-TT

AR20-HZL-TT

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components

3,709
RFQ
AR20-HZL-TT

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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