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IC Sockets

Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
AR16-HZL-TT

AR16-HZL-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

4,631
RFQ
AR16-HZL-TT

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A48-LC-TR

A48-LC-TR

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

4,938
RFQ
A48-LC-TR

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
AW 127-15/Z-T

AW 127-15/Z-T

SOCKET 15 CONTACTS SINGLE ROW

Assmann WSW Components

1,797
RFQ
AW 127-15/Z-T

Datasheet

- - Active - - - - - - - - - - - - - - -
116-87-304-41-003101

116-87-304-41-003101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

1,171
RFQ
116-87-304-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-304-41-117101

114-83-304-41-117101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,464
RFQ
114-83-304-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A 42-LC-TR

A 42-LC-TR

SOCKET

Assmann WSW Components

4,810
RFQ
A 42-LC-TR

Datasheet

A Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
114-87-306-41-117101

114-87-306-41-117101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

4,657
RFQ
114-87-306-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-306-41-134161

114-87-306-41-134161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,857
RFQ
114-87-306-41-134161

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X08-011B

SIP1X08-011B

SIP1X08-011B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

4,312
RFQ
SIP1X08-011B

Datasheet

SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
110-83-304-41-005101

110-83-304-41-005101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

4,991
RFQ
110-83-304-41-005101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
01-0513-11

01-0513-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,018
RFQ
01-0513-11

Datasheet

0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-1518-00

02-1518-00

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,116
RFQ
02-1518-00

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-306-41-001101

115-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,530
RFQ
115-87-306-41-001101

Datasheet

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 22-HZL-TT

AR 22-HZL-TT

SOCKET

Assmann WSW Components

1,301
RFQ
AR 22-HZL-TT

Datasheet

- Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AW 127-16/Z-T

AW 127-16/Z-T

SOCKET 16 CONTACTS SINGLE ROW

Assmann WSW Components

4,917
RFQ
AW 127-16/Z-T

Datasheet

- - Active - - - - - - - - - - - - - - -
AR08-HZL/07-TT

AR08-HZL/07-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

3,681
RFQ
AR08-HZL/07-TT

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
HLS-0101-T-10

HLS-0101-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,654
RFQ
HLS-0101-T-10

Datasheet

HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
SA1000300000G

SA1000300000G

SA-7.43- 10P ; CLIP:TIN200U" PI

Amphenol Anytek

1,227
RFQ
SA1000300000G

Datasheet

SU Bulk Active SIP 10 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
02-0518-10H

02-0518-10H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

1,175
RFQ
02-0518-10H

Datasheet

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0518-10T

02-0518-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

1,196
RFQ
02-0518-10T

Datasheet

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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