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IC Sockets

Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-83-318-41-605101

110-83-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,513
RFQ
110-83-318-41-605101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
121-83-310-41-001101

121-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,834
RFQ
121-83-310-41-001101

Datasheet

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
130-024-050

130-024-050

CONN IC DIP SOCKET 24POS GOLD

3M

4,633
RFQ
130-024-050

Datasheet

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
110-83-320-41-001151

110-83-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,664
RFQ
110-83-320-41-001151

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-314-41-134191

114-83-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

4,422
RFQ
114-83-314-41-134191

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0513-11

05-0513-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,117
RFQ
05-0513-11

Datasheet

0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP050-1X16-160B

SIP050-1X16-160B

1X16-160B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

1,318
RFQ
SIP050-1X16-160B

Datasheet

SIP050-1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
917-87-108-41-053101

917-87-108-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

4,242
RFQ
917-87-108-41-053101

Datasheet

917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
917-87-208-41-053101

917-87-208-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

4,255
RFQ
917-87-208-41-053101

Datasheet

917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 64-HGL-TT

AR 64-HGL-TT

SOCKET

Assmann WSW Components

3,549
RFQ
AR 64-HGL-TT

Datasheet

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
814-AG11D-ES

814-AG11D-ES

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

3,980
RFQ
814-AG11D-ES

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
410-83-216-10-001101

410-83-216-10-001101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

4,256
RFQ
410-83-216-10-001101

Datasheet

410 Bulk Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-83-216-10-002101

410-83-216-10-002101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

4,341
RFQ
410-83-216-10-002101

Datasheet

410 Bulk Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
11-0513-10

11-0513-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,938
RFQ
11-0513-10

Datasheet

0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-0513-10T

12-0513-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics

1,665
RFQ
12-0513-10T

Datasheet

0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0503-21

02-0503-21

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,512
RFQ
02-0503-21

Datasheet

0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
02-0503-31

02-0503-31

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,565
RFQ
02-0503-31

Datasheet

0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
06-0518-11H

06-0518-11H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2,288
RFQ
06-0518-11H

Datasheet

518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-1518-11H

06-1518-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,748
RFQ
06-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
13-0518-10H

13-0518-10H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,877
RFQ
13-0518-10H

Datasheet

518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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