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IC Sockets

Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
05-0518-11H

05-0518-11H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,565
RFQ
05-0518-11H

Datasheet

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
13-0518-10

13-0518-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,689
RFQ
13-0518-10

Datasheet

518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
03-0508-30

03-0508-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

1,748
RFQ
03-0508-30

Datasheet

508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
SIP1X27-014B

SIP1X27-014B

SIP1X27-014B-SIP SOCKET 27 CTS

Amphenol ICC (FCI)

3,673
RFQ
SIP1X27-014B

Datasheet

SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
116-87-610-41-007101

116-87-610-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

4,124
RFQ
116-87-610-41-007101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-312-41-105101

110-83-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

4,600
RFQ
110-83-312-41-105101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-324-41-605101

110-87-324-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,630
RFQ
110-87-324-41-605101

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-324-41-005101

110-87-324-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,348
RFQ
110-87-324-41-005101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0102-G-12

HLS-0102-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,853
RFQ
HLS-0102-G-12

Datasheet

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ARO 64-HZL/NEC-T

ARO 64-HZL/NEC-T

SOCKET

Assmann WSW Components

3,222
RFQ
ARO 64-HZL/NEC-T

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
540-99-032-24-000000

540-99-032-24-000000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

4,551
RFQ
540-99-032-24-000000

Datasheet

540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
AR24-HZL/7/07-TT

AR24-HZL/7/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

4,088
RFQ
AR24-HZL/7/07-TT

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
ED044PLCZ

ED044PLCZ

CONN SOCKET PLCC 44POS TIN

On Shore Technology Inc.

1,787
RFQ
ED044PLCZ

Datasheet

ED Tube Active PLCC 44 (2 x 22) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
A-ICS-254-08-TT50

A-ICS-254-08-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

3,674
RFQ
A-ICS-254-08-TT50

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
D2614-42

D2614-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

4,008
RFQ
D2614-42

Datasheet

D26 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 32 HGL-TT

AR 32 HGL-TT

SOCKET

Assmann WSW Components

4,019
RFQ
AR 32 HGL-TT

Datasheet

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-83-308-41-009101

116-83-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,069
RFQ
116-83-308-41-009101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
10-2513-10T

10-2513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,291
RFQ
10-2513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-0518-11

09-0518-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

1,249
RFQ
09-0518-11

Datasheet

518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0518-10H

11-0518-10H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,373
RFQ
11-0518-10H

Datasheet

518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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