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IC Sockets

Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
123-87-308-41-001101

123-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,226
RFQ
123-87-308-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-316-41-605101

110-87-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

1,979
RFQ
110-87-316-41-605101

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-610-41-005101

110-83-610-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,217
RFQ
110-83-610-41-005101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
03-0513-10H

03-0513-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

4,148
RFQ
03-0513-10H

Datasheet

0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-314-41-001101

115-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1,090
RFQ
115-87-314-41-001101

Datasheet

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ED028PLCZ-SM-N

ED028PLCZ-SM-N

CONN SOCKET PLCC 28POS

On Shore Technology Inc.

4,006
RFQ
ED028PLCZ-SM-N

Datasheet

ED Tube Active PLCC 28 (2 x 14) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
822499-1

822499-1

CONN SOCKET PLCC 44POS TIN-LEAD

TE Connectivity AMP Connectors

3,762
RFQ
822499-1

Datasheet

- Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Thermoplastic -
AR 36-HGL-TT

AR 36-HGL-TT

SOCKET

Assmann WSW Components

1,791
RFQ
AR 36-HGL-TT

Datasheet

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
DIP328-011B

DIP328-011B

DIP328-011B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

4,671
RFQ
DIP328-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR 52-HZL-TT

AR 52-HZL-TT

SOCKET

Assmann WSW Components

4,982
RFQ
AR 52-HZL-TT

Datasheet

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
03-0518-11H

03-0518-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

1,896
RFQ
03-0518-11H

Datasheet

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
07-0518-10T

07-0518-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics

1,535
RFQ
07-0518-10T

Datasheet

518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-1518-10

08-1518-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

4,989
RFQ
08-1518-10

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A40-LCG

A40-LCG

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

3,340
RFQ
A40-LCG

Datasheet

- - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
116-83-306-41-012101

116-83-306-41-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

4,735
RFQ
116-83-306-41-012101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-210-31-012101

614-87-210-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

4,655
RFQ
614-87-210-31-012101

Datasheet

614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-310-31-012101

614-87-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

4,071
RFQ
614-87-310-31-012101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0102-G-2

HLS-0102-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,390
RFQ
HLS-0102-G-2

Datasheet

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
612-83-308-41-001101

612-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

1,737
RFQ
612-83-308-41-001101

Datasheet

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW 127-39/Z-T

AW 127-39/Z-T

SOCKET 39 CONTACTS SINGLE ROW

Assmann WSW Components

3,517
RFQ
AW 127-39/Z-T

Datasheet

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